Oct 1, 2015
Driven by ever-increasing requirements on improved wafer temperature uniformity for smaller features on the wafer, equipment manufacturers are developing heated plates (or chucks) with more and more actuator zones to achieve finer resolution of the actuated heat. From...
Oct 1, 2014
The manufacturing of Integrated Circuits (ICs) on semiconductor wafers involves hundreds of complex and expensive process steps. Defects can occur during any of several steps such as etch, resist removal, particle contamination, incomplete process, process variations,...
Oct 3, 2013
Detecting the health and proper operation of equipment during manufacturing is an important part of maintaining high yields. This paper describes a model-based approach to detecting changes in equipment during manufacturing. Physics-based mathematical models of the...
Oct 3, 2012
This paper describes the development of a COMSOL model of Electro-Chemical-Mechanical Planarization (ECMP) that was validated with experimental data. ECMP is used for processing of semiconductor wafers. We developed a 2D model of flow of phosphoric acid solution (the...
Sep 1, 2012
Many modern thermal processing systems involve temperature control of heated plates. In many systems such as Metal-Organic Chemical Vapor Deposition (MOCVD) and epitaxial deposition (Epi) systems, the plates are often thick carriers or susceptors on which one or more...
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