Oct 1, 2014
The manufacturing of Integrated Circuits (ICs) on semiconductor wafers involves hundreds of complex and expensive process steps. Defects can occur during any of several steps such as etch, resist removal, particle contamination, incomplete process, process variations,...
Aug 8, 2014
A series of nonlinear seismic time history analyses was conducted in LS-DYNA to evaluate the seismic performance of buried reinforced concrete fluid storage structures. This study is aimed at presenting a sophisticated modeling procedure in time domain for...
Oct 3, 2013
Detecting the health and proper operation of equipment during manufacturing is an important part of maintaining high yields. This paper describes a model-based approach to detecting changes in equipment during manufacturing. Physics-based mathematical models of the...
Sep 1, 2012
Many modern thermal processing systems involve temperature control of heated plates. In many systems such as Metal-Organic Chemical Vapor Deposition (MOCVD) and epitaxial deposition (Epi) systems, the plates are often thick carriers or susceptors on which one or more...
Sep 1, 2011
Many modern thermal processing systems involve temperature control of heated plates. In most Rapid Thermal Processing (RTP) systems, the ‘plate’ is a single wafer that is heated from one or both sides by an array of tungsten halogen lamps. In many other systems such...
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