Oct 1, 2016
Driven by ever-increasing requirements on improved wafer temperature uniformity for smaller features on the wafer, equipment manufacturers are developing heated plates (or chucks) with more and more actuator zones to achieve finer resolution of the actuated heat. From...
Oct 1, 2015
Driven by ever-increasing requirements on improved wafer temperature uniformity for smaller features on the wafer, equipment manufacturers are developing heated plates (or chucks) with more and more actuator zones to achieve finer resolution of the actuated heat. From...
Oct 1, 2014
The manufacturing of Integrated Circuits (ICs) on semiconductor wafers involves hundreds of complex and expensive process steps. Defects can occur during any of several steps such as etch, resist removal, particle contamination, incomplete process, process variations,...
Mar 9, 2014
This study introduces an efficient procedure to estimate the structural response of a suspension bridge in real time based on a limited set of measured data. Unlike conventional techniques, the proposed procedure does not employ mode shapes and frequencies. In this...
Oct 3, 2013
Detecting the health and proper operation of equipment during manufacturing is an important part of maintaining high yields. This paper describes a model-based approach to detecting changes in equipment during manufacturing. Physics-based mathematical models of the...
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